This course will cover all aspects of pre-thinning and focus on final thinning via Tripod Polishing. Due to the limited class size and the extensive hands-on opportunities, this course is well suited to novices as well as advanced Tripodders. The course will include sections on:
This course will be unique in that it will provide a hands-on opportunity for every class participant. Tripod Polishers, Polishing Wheels, and pre-thinning equipment will be made available to all participants and actual samples will be prepared - by the students - as part of the course. This is a great opportunity to get your hands dirty and actually learn by doing. The instructors will walk you through each step of the process and then let you loose on the equipment. This course is designed to teach the Tripod Polishing technique. Silicon samples will be provided to the students and used as the basis for the course teaching.
INTEL, AMD, Motorola, LSI Logic, Conner Peripherals, Univ of Maryland, Univ of New Mexico, UNAM (Mexico), LG Electronics (Korea), Battelle, MEMC, MVA Inc., Univ of Michigan, U.S. Bureau of Mines.
Due to the intensive hands-on aspects of this course, class size will be strictly limited to 10 participants.
Registration Fee: $795 (includes lunches and Friday night Dinner)
$695 if registration fee paid by January 12, 1996
Registration Deadline: January 30, 1996
For additional Information: Monica Pflaster
South Bay Technology, Inc.
1120 Via Callejon
San Clemente, CA 92673
TEL: 800-728-2233
FAX: 714-492-1499
e-mail: sbt@msa.microscopy.com