Manufacturer: AJA International, Inc.
Model: Orion 5 UHV
Process: Insulator Deposition
This tool uses high frequency RF to develop an electrical field to evaporate metallic materials onto a sample of single wafer.
Manufacturer: CHA Industries
Model: SEC-1000-RAP
E-beam evaporator -CHA uses an electron beam to evaporate metallic materials onto a sample or a multitude wafers.
Process: Metallization
Ellipsometry is an optical technique for investigating the dielectric properties (complex refractive index or dielectric function) of thin films. Ellipsometry measures the change of polarization upon reflection or transmission and compares it to a model.
It can be used to characterize composition, roughness, thickness (depth), crystalline nature, doping concentration, electrical conductivity and other material properties. It is very sensitive to the change in the optical response of incident radiation that interacts with the material being investigated.
Quantity: 4
Manufacturer: Thermo Scientific
Model: Cimarec
Manufacturer: KLA Tencor
Model: D-500
The Alpha-Step D-500 Stylus Profiler offers industry-leading high resolution 2D profiling, 2D stress, profile stitching and many additional features in an easy-to-use platform. The system includes a 140 mm manual stage and an innovative optical lever sensor technology. The Alpha-Step D-500 also includes advanced optics and enhanced video controls for highly versatile sample visualization.
Process: Metrology
Manufacturer: Kurt J Lesker
Model: Nano 36
KJLC's most advanced deposition system platform, designed specifically with the entry to mid level user in mind. The NANO 36 is designed to accommodate most evaporation processes, or it can be configured for magnetron sputtering applications. The NANO 36 is highly capable and has a compact form factor.Features:
Process: Metallization
Quantity: 3
Manufacturer: Suss
Model: MJB3
Uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate.
Process: Photolithography
Manufacturer: MTI
Model: RTP-1000D4
Rapid Thermal Annealer consists of heating a single sample or wafer at a time in order to affect its electrical properties.
Process: Rapid Thermal Processing
Manufacturer: Self-Built
The probe station is used to physically acquire signals from the internal nodes of a semiconductor device. The probe station utilizes manipulators which allow the precise positioning of thin needles on the surface of a semiconductor device. If the device is being electrically stimulated, the signal is acquired by the mechanical probe and is displayed on an SMU instrument. The probe station is often used in the failure analysis of semiconductor devices.
Process: Metrology
Manufacturer: Self Built
Process: Insulator Deposition
Atomic layer deposition (ALD) is a thin film deposition technique that is based on the sequential use of a gas phase chemical process. ALD is considered a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals, typically called precursors. These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. Through the repeated exposure to separate precursors, a thin film is slowly deposited. ALD is a key process in the fabrication of semiconductor devices, and part of the set of tools available for the synthesis of nanomaterials. MREC's Atomic Layer Deposition system has the capability of depositing conformal thin film coating of the size up to 3" in diameter, can be used to grow semiconductor materials including ZnO, TiO2, AlN, Al2O3 etc. With the plasma function embedded, the deposition quality is improved significantly compared with the regular H2O precusor reaction.
Manufacturer: Self-Built
Model: Genesis 01
Pulsed Electron Deposition System is a physical vapor deposition equipment using pulsed E-beam energy to bombard the target and produce the material beam flux for deposition. The equipment is good for depositing ZnO, GaN, Al2N3, GeTe etc.
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K). The sputtered ions (typically only a small fraction of the ejected particles are ionized — on the order of 1%) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (causing re-sputtering). Alternatively, at higher gas pressures, the ions collide with the gas atoms that act as a moderator and move diffusively, reaching the substrates or vacuum chamber wall and condensing after undergoing a random walk. The entire range from high-energy ballistic impact to low-energy thermalized motion is accessible by changing the background gas pressure. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer, the atomic weight of the sputtering gas should be close to the atomic weight of the target, so for sputtering light elements neon is preferable, while for heavy elements krypton or xenon are used. Reactive gasses can also be used to sputter compounds. The compound can be formed on the target surface, in-flight or on the substrate depending on the process parameters. The availability of many parameters that control sputter deposition make it a complex process, but also allow experts a large degree of control over the growth and microstructure of the film.
Manufacturer: Specialty Coating System
Model: PDS 2010
"Parylene Coater - SCS" uses parylene to make a conformal protective polymer coating material utilized to uniformly protect any component configuration on such diverse substrates as metal, glass, paper, resin, plastic, ceramic, ferrite and silicon. Because of its unique properties, Parylene conforms to virtually any shape, including sharp edges, crevices, points; or flat and exposed internal surfaces.
Process: Insulator Deposition
Manufacturer: Shenyang Instruments
This tool uses high frequency RF to develop an electrical field to evaporate metallic materials onto a sample of single wafer.
Process: Insulator Deposition
Manufacturer: Technics
Model: PlanarEtch II
This tool produces a plasma using oxygen, helium and argon gases and high frequency RF. It is used to "descum" residual resist or to etch away unexposed regions of wafer patterning.
Process: Plasma Cleaning/Etching
Manufacturer: Heidelberg Instrument
Model: uPG 101
The μPG 101 is an extremely economical and easy to use micro pattern generator for direct writing applications and low volume mask making. The system can be used for applications such as MEMS, Bio MEMS, Integrated Optics, Micro Fluidics or any other application that requires high precision, high-resolution microstructures.The μPG 101 offers a very small footprint of only 60 x 75 cm² featuring a compact design with all electronic components integrated into the system. A personal computer is used for system control. The Windows® based control software makes it easy for users to convert the designs, perform a manual or automatic alignment and start the exposure.The µPG 101 is designed to provide an easy and fast way to create the microstructures needed for your business or research. The tabletop system features exchangeable write modes to meet the resolution and write speed requirements of your specific application. It is the only available desktop lithography system in the market, which can produce sub-micron features. The small address grid allows placement of structures with very high accuracy. The real-time autofocus system monitors and corrects focus position during exposure, which guarantees high resolution and repeatability over the entire exposure area. Small address grid and real-time autofocus system are essential features for a professional micro pattern solution.Applications for the µPG 101 include Life Science, MEMS, Semiconductor, Sensors, Actuators, MOEMS, Material Research, Nano-Tubes, Graphene, and any other application that requires microstructures. Reference: https://www.himt.de/index.php/upg-101.html
Process: Photolithography
